AC

Alex Chew

AP Advanpack Solutions Pte: 3 patents #9 of 37Top 25%
Overall (All Time): #1,584,354 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
7456496 Package design and method of manufacture for chip grid array Tan Kim Hwee, Roman Perez, Kee Kwang Lau, Antonio B. Dimaano, Jr. 2008-11-25
6929981 Package design and method of manufacture for chip grid array Tan Kim Hwee, Roman Perez, Kee Kwang Lau, Antonio B. Dimaano, Jr. 2005-08-16
6734039 Semiconductor chip grid array package design and method of manufacture Tan Kim Hwee, Roman Perez, Kee Kwang Lau, Antonio B. Dimaano, Jr. 2004-05-11