Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10653010 | Connection of multilayer printed conductive ink through filled microvias | Weifeng Liu, William L. Uy, Dongkai Shangguan | 2020-05-12 |
| 6484393 | Method for wire bonding to flexible substrates | — | 2002-11-26 |
| 5713563 | Wire bonding to flexible substrates | — | 1998-02-03 |