Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9174361 | Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece | — | 2015-11-03 |
| 8844511 | Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material | Maximilian Kaeser | 2014-09-30 |