Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7550852 | Composite metal column for mounting semiconductor device | John Paul Tellkamp | 2009-06-23 |
| 7452799 | Ball film for integrated circuit fabrication and testing | — | 2008-11-18 |
| 7439612 | Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector | — | 2008-10-21 |
| 7371673 | Method and apparatus for attaching an IC package to a PCB assembly | — | 2008-05-13 |
| 7220606 | Integrated circuit identification | — | 2007-05-22 |
| 7132314 | System and method for forming one or more integrated circuit packages using a flexible leadframe structure | — | 2006-11-07 |
| 7125789 | Composite metal column for mounting semiconductor device | John Paul Tellkamp | 2006-10-24 |
| 7078821 | Ball film for integrated circuit fabrication and testing | — | 2006-07-18 |
| 6969641 | Method and system for integrated circuit packaging | — | 2005-11-29 |
| 6951980 | Package for an electrical device | — | 2005-10-04 |
| 6872593 | Vertical mold die press machine | — | 2005-03-29 |
| 6840751 | Vertical mold die press machine | — | 2005-01-11 |
| 6812477 | Integrated circuit identification | — | 2004-11-02 |
| 4625493 | Apparatus for wrapping the end surface of cylindrical object | Yoshio Yagi, Toshihiko Kondo, Norio Matsubara, Shoichiro Miyazaki, Atsumi Seya +1 more | 1986-12-02 |
| 4578925 | Method of and apparatus for packaging a wall of a bore | — | 1986-04-01 |