Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9240256 | Bonding material and bonding method using the same | Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Toshihiko Ueyama | 2016-01-19 |
| 8858700 | Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method | Keiichi Endoh, Yutaka Hisaeda, Toshihiko Ueyama | 2014-10-14 |
| 8641929 | Low-temperature-sinterable bonding material, and bonding method using the bonding material | Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Toshihiko Ueyama | 2014-02-04 |