Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6891260 | Integrated circuit package substrate with high density routing mechanism | Leonard L. Mora | 2005-05-10 |
| 6777802 | Integrated circuit package substrate with multiple voltage supplies | Leonard L. Mora, Ed Fulcher | 2004-08-17 |