Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11009477 | Integrated multi-sensor module | Olivier Le Neel, Ravi Shankar, Suman Cherian, Tien-Choy Loh, Shian-Yeu Kam | 2021-05-18 |
| 10905362 | Flexible electrochemical micro-sensor | Olivier Le Neel, Suman Cherian | 2021-02-02 |
| 10317357 | Integrated multi-sensor module | Olivier Le Neel, Ravi Shankar, Suman Cherian, Tien-Choy Loh, Shian-Yeu Kam | 2019-06-11 |
| 10299711 | Flexible electrochemical micro-sensor | Olivier Le Neel, Suman Cherian | 2019-05-28 |
| 10094797 | Integrated multi-sensor module | Olivier Le Neel, Ravi Shankar, Suman Cherian, Tien-Choy Loh, Shian-Yeu Kam | 2018-10-09 |
| 9918667 | Flexible electrochemical micro-sensor | Olivier Le Neel, Suman Cherian | 2018-03-20 |
| 9866658 | Method and apparatus for SAS open address frame processing in SAS expanders | Cheng Yi, Heng Liao | 2018-01-09 |
| 9689824 | Integrated multi-sensor module | Olivier Le Neel, Ravi Shankar, Suman Cherian, Tien-Choy Loh, Shian-Yeu Kam | 2017-06-27 |
| 9651627 | Accumulated power consumption sensor: application in smart batteries systems | Olivier Le Neel | 2017-05-16 |
| 9530681 | Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device | Olivier Le Neel | 2016-12-27 |
| 9437798 | Combo bio and temperature disposable sensor on flexible foil | Olivier Le Neel, Suman Cherian, Ravi Shankar, Tien-Choy Loh, Shian-Yeu Kam | 2016-09-06 |
| 9257423 | Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device | Olivier Le Neel | 2016-02-09 |
| 9176089 | Integrated multi-sensor module | Olivier Le Neel, Ravi Shankar, Suman Cherian, Tien-Choy Loh, Shian-Yeu Kam | 2015-11-03 |
| 8809861 | Thin film metal-dielectric-metal transistor | Olivier Le Neel, Ravi Shankar | 2014-08-19 |
| 8786396 | Heater design for heat-trimmed thin film resistors | Olivier Le Neel | 2014-07-22 |
| 8659085 | Lateral connection for a via-less thin film resistor | Hui Chong Vince Ng, Olivier Le Neel | 2014-02-25 |
| 8558654 | Vialess integration for dual thin films—thin film resistor and heater | Olivier Le Neel, Stefania Maria Serena Privitera, Pascale Dumont-Girard, MaurizoGabriele Castorina | 2013-10-15 |
| 8436426 | Multi-layer via-less thin film resistor | Olivier Le Neel | 2013-05-07 |
| 8400257 | Via-less thin film resistor with a dielectric cap | Ting Fang Lim, Chengyu Niu, Olivier Le Neel | 2013-03-19 |
| 8095722 | Connection management in serial attached SCSI (SAS) expanders | Heng Liao, Kuan Hua Tan | 2012-01-10 |
| 7584319 | Connection management in serial attached SCSI (SAS) expanders | Heng Liao, Kuan Hua Tan | 2009-09-01 |
| 5604735 | High speed network switch | Frank H. Levinson, Mark Farley, Minh Q. Vu | 1997-02-18 |