Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9870978 | Heat spreading in molded semiconductor packages | — | 2018-01-16 |
| 7020582 | Methods and apparatus for laser marking of integrated circuit faults | John DiCosola, Adam Wright, Junzhao Lei, Mark Andrew Banke | 2006-03-28 |