Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11750190 | Encoded on-die termination for efficient multipackage termination | Veeresh Garag | 2023-09-05 | $19,899,000 |
| 10985136 | Microelectronic die stack having at least one rotated microelectronic die | — | 2021-04-20 | $53,056,000 |