Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5863832 | Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system | Brian S. Doyle, Leopoldo D. Yau | 1999-01-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5863832 | Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system | Brian S. Doyle, Leopoldo D. Yau | 1999-01-26 |