Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5751556 | Method and apparatus for reducing warpage of an assembly substrate | Ricardo Suarez-Gartner | 1998-05-12 | $59,372,000 |
| 5535094 | Integrated circuit package with an integral heat sink and fan | Daryl J. Nelson, Muralidhar Tirumala, Gerald A. Budelman | 1996-07-09 | $32,989,000 |