MH

Max Mah Boon Hooi

IN Intel: 1 patents #18,218 of 30,777Top 60%
📍 Butterworth, MY: #26 of 50 inventorsTop 55%
Overall (All Time): #3,197,710 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8124471 Method of post-mold grinding a semiconductor package James Yii Lee Kiong, Chong Hin Tan, Shivaram Sahadevan, Tang Shiau Phing 2012-02-28