Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8124471 | Method of post-mold grinding a semiconductor package | James Yii Lee Kiong, Shivaram Sahadevan, Max Mah Boon Hooi, Tang Shiau Phing | 2012-02-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8124471 | Method of post-mold grinding a semiconductor package | James Yii Lee Kiong, Shivaram Sahadevan, Max Mah Boon Hooi, Tang Shiau Phing | 2012-02-28 |