Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8124471 | Method of post-mold grinding a semiconductor package | James Yii Lee Kiong, Shivaram Sahadevan, Max Mah Boon Hooi, Tang Shiau Phing | 2012-02-28 | $20,590,000 |