Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222118 | Wafer backside grinding with stress relief | Arturo Urquiza, Charles Singleton, Tim McIntosh | 2012-07-17 |
| 7795116 | Wafer cutting methods and packages using dice derived therefrom | Erasenthiran Poonjolai | 2010-09-14 |