Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8207057 | Microball assembly methods, and packages using maskless microball assemblies | Lakshmi Supriva | 2012-06-26 |
| 7795116 | Wafer cutting methods and packages using dice derived therefrom | Mark Dydyk | 2010-09-14 |