Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6841470 | Removal of residue from a substrate | Li Wang | 2005-01-11 | $22,975,000 |
| 6380072 | Metallizing process of semiconductor industry | Der-Tsyr Fan, Chon-Shin Jou, Ting-Sing Wang | 2002-04-30 | |
| 5936301 | Crack resistant passivation layer | — | 1999-08-10 | $109,908,000 |
| 5747389 | Crack resistant passivation layer | — | 1998-05-05 | $55,348,000 |
| 4775550 | Surface planarization method for VLSI technology | Sanjiv Mittal, John T. Orton, Jagir S. Multani, Robert Jecmen | 1988-10-04 | $56,105,000 |