Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12476183 | Punch-through interconnect feature to couple upper electrodes of capacitors of multi-level memory arrays | Travis W. Lajoie, Juan Alzate Vinasco, Abhishek Sharma, Van H. Le, Moshe Dolejsi +3 more | 2025-11-18 | |
| 12426247 | Capacitor connections in dielectric layers | Travis W. Lajoie, Abhishek A. Sharma, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang +13 more | 2025-09-23 | |
| 11832438 | Capacitor connections in dielectric layers | Travis W. Lajoie, Abhishek A. Sharma, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang +13 more | 2023-11-28 | $31,872,000 |
| 11563107 | Method of contact patterning of thin film transistors for embedded DRAM using a multi-layer hardmask | Chieh-Jen Ku, Bernhard Sell, Pei-Hua Wang, Nikhil MEHTA, Shu Zhou +5 more | 2023-01-24 | $19,543,000 |