Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11239126 | Rod-based substrate with ringed interconnect layers | Wei Tan, Boon Ping Koh, Nik Mohamed Azeim Nik Zurin, Kai Chong Ng | 2022-02-01 | $16,992,000 |
| 10779402 | Noise sensitive trace 3D ground-shielding crosstalk mitigation | Kai Chong Ng, Natasya Athirah Abdul Khalid, Yee Hung See Tau, Asmah Truky, Ying Ern Ho | 2020-09-15 | $34,212,000 |