Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239126 | Rod-based substrate with ringed interconnect layers | Wei Tan, Boon Ping Koh, Nik Mohamed Azeim Nik Zurin, Kai Chong Ng | 2022-02-01 |
| 10779402 | Noise sensitive trace 3D ground-shielding crosstalk mitigation | Kai Chong Ng, Natasya Athirah Abdul Khalid, Yee Hung See Tau, Asmah Truky, Ying Ern Ho | 2020-09-15 |