Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7678616 | Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit | Jiun Hann Sir | 2010-03-16 |
| 7439618 | Integrated circuit thermal management method and apparatus | Jiun Hann Sir | 2008-10-21 |
| 7332823 | Providing a metal layer in a semiconductor package | Lee Peng Khaw, Wooi Tan, Tze Yang Hin | 2008-02-19 |