Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8535986 | Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame | Liang Kng Ian Koh | 2013-09-17 |
| 7635910 | Semiconductor package and method | Najib Khan Surattee, Mohamad Yazid | 2009-12-22 |