Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8535986 | Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame | Richard Mangapul Sinaga | 2013-09-17 |
| RE41510 | Lead frame | Heng Wan Hong, Tian Siang Yip, Joo Hong Tan, Choon Muah Lee | 2010-08-17 |
| 7294853 | Substrate for mounting a semiconductor | — | 2007-11-13 |
| 7193298 | Lead frame | Heng Wan Hong, Tian Siang Yip, Joo Hong Tan, Choon Muah Lee | 2007-03-20 |