Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177318 | Semiconductor package and method of forming the same | Teck Guan Lim, Hideaki Fukuzawa | 2021-11-16 |
| 8921166 | Structure and method for placement, sizing and shaping of dummy structures | Sebastian Schmidt, Thomas Schafbauer, Yayi Wei | 2014-12-30 |
| 8229062 | Transmission mask with differential attenuation to improve ISO-dense proximity | Sebastian Schmidt, Benjamin Szu-Min Lin | 2012-07-24 |
| 7868427 | Structure and method for placement, sizing and shaping of dummy structures | Sebastian Schmidt, Thomas Schafbauer, Yayi Wei | 2011-01-11 |
| 7807342 | Transmission mask with differential attenuation to improve ISO-dense proximity | Sebastian Schmidt, Benjamin Szu-Min Lin | 2010-10-05 |
| 7494930 | Structure and method for placement, sizing and shaping of dummy structures | Sebastian Schmidt, Thomas Schafbauer, Yayi Wei | 2009-02-24 |
| 7071074 | Structure and method for placement, sizing and shaping of dummy structures | Sebastian Schmidt, Thomas Schafbauer, Yayi Wei | 2006-07-04 |
| 7052808 | Transmission mask with differential attenuation to improve ISO-dense proximity | Sebastian Schmidt, Benjamin Szu-Min Lin | 2006-05-30 |