Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851261 | Semiconductor package and method of assembling the same | Fui Jin Chai | 2010-12-14 |
| 7481641 | Apparatus and method for producing an article by means of a molding technique | Edward Fuergut | 2009-01-27 |