Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848213 | Semiconductor module having a layer that includes inorganic filler and a casting material | Sebastian Michalski | 2023-12-19 |
| 11121004 | Semiconductor module and method for producing the same | Sebastian Michalski | 2021-09-14 |
| 9978711 | Method for connecting a semiconductor chip metal surface of a substrate by means of two contact metallization layers and method for producing an electronic module | Christian Stahlhut | 2018-05-22 |
| 9349794 | Layer arrangement | Christian Fachmann | 2016-05-24 |
| 8916453 | Method for manufacturing an electronic component | Armin Tilke | 2014-12-23 |
| 8772948 | Method for manufacturing a layer arrangement, and a layer arrangement | Christian Fachmann | 2014-07-08 |