Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6406743 | Nickel-silicide formation by electroless Ni deposition on polysilicon | Tzuen-Hsi Huang | 2002-06-18 |
| 6333235 | Method for forming SiGe bipolar transistor | Tzuen-Hsi Huang | 2001-12-25 |
| 6228733 | Non-selective epitaxial depostion technology | Tzuen-Hsi Huang | 2001-05-08 |
| 6180478 | Fabrication process for a single polysilicon layer, bipolar junction transistor featuring reduced junction capacitance | Tzuen-Hsi Huang, Tsyr-Shyang Liou | 2001-01-30 |
| 6180523 | Copper metallization of USLI by electroless process | Tzuen-Hsi Huang | 2001-01-30 |
| 6046107 | Electroless copper employing hypophosphite as a reducing agent | Tzuen-Hsi Huang | 2000-04-04 |
| 6030877 | Electroless gold plating method for forming inductor structures | Tzuen-Hsi Huang | 2000-02-29 |
| 5917244 | Integrated circuit inductor structure formed employing copper containing conductor winding layer clad with nickel containing conductor layer | Tzuen-Hsi Huang | 1999-06-29 |
| 5801100 | Electroless copper plating method for forming integrated circuit structures | Tzuen-Hsi Huang | 1998-09-01 |
| 5795619 | Solder bump fabricated method incorporate with electroless deposit and dip solder | Kwang-Lung Lin | 1998-08-18 |
| 5776813 | Process to manufacture a vertical gate-enhanced bipolar transistor | Tzuen-Hsi Huang | 1998-07-07 |
| 5583073 | Method for producing electroless barrier layer and solder bump on chip | Kwang-Lung Lin | 1996-12-10 |