Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10537030 | Voiding control using solid solder preforms embedded in solder paste | Lei Luo, Christopher John Nash, Derrick Herron | 2020-01-14 |
{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Indium", "item": "https://www.patentleaderboard.com/company/indium"}, {"@type": "ListItem", "position": 3, "name": "Zhenxi Wei", "item": "https://www.patentleaderboard.com/inventor/fl:zh_ln:wei-30"}]}
Skip to contentShowing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10537030 | Voiding control using solid solder preforms embedded in solder paste | Lei Luo, Christopher John Nash, Derrick Herron | 2020-01-14 |