Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10537030 | Voiding control using solid solder preforms embedded in solder paste | Zhenxi Wei, Lei Luo, Derrick Herron | 2020-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10537030 | Voiding control using solid solder preforms embedded in solder paste | Zhenxi Wei, Lei Luo, Derrick Herron | 2020-01-14 |