Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997458 | Method for manufacturing germamde interconnect structures and corresponding interconnect structures | Antony Premkumar Peter, Marc Schaekers, Sven Van Elshocht, Zsolt Tokei | 2018-06-12 |
| 7338896 | Formation of deep via airgaps for three dimensional wafer to wafer interconnect | Serge Vanhaelemeersch, Eddy Kunnen | 2008-03-04 |