Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9006099 | Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bump | David N. Okada | 2015-04-14 |
| 8963239 | 800 V superjunction device | Takeshi Ishiguro, Kenji Sugiura | 2015-02-24 |
| 8946814 | Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gates | Takeshi Ishiguro | 2015-02-03 |
| 8921186 | Semiconductor device and method of forming high voltage SOI lateral double diffused MOSFET with shallow trench insulator | Patrick M. Shea, David N. Okada | 2014-12-30 |
| 8895430 | Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumps | Gary Dashney, David N. Okada | 2014-11-25 |
| 8812778 | Fast block device and methodology | Douglas Dumitru | 2014-08-19 |
| 8736019 | Semiconductor devices with sealed, unlined trenches and methods of forming same | Koon Chong So | 2014-05-27 |
| 8716829 | Semiconductor devices with sealed, unlined trenches and methods of forming same | Koon Chong So | 2014-05-06 |
| 8380944 | Fast block device and methodology | Douglas Dumitru | 2013-02-19 |
| 8138558 | Semiconductor device and method of forming low voltage MOSFET for portable electronic devices and data processing centers | Patrick M. Shea | 2012-03-20 |
| 8129252 | Semiconductor devices with sealed, unlined trenches and methods of forming same | Koon Chong So | 2012-03-06 |
| 7944018 | Semiconductor devices with sealed, unlined trenches and methods of forming same | Koon Chong So | 2011-05-17 |
| 7842568 | Lateral power semiconductor device for high frequency power conversion system, has isolation layer formed over substrate for reducing minority carrier storage in substrate | David N. Okada | 2010-11-30 |
| 7800223 | Chip-scale monolithic load switch for portable applications | David N. Okada | 2010-09-21 |
| 7649247 | Radiation hardened lateral MOSFET structure | David N. Okada | 2010-01-19 |
| 7605435 | Bi-directional MOSFET power switch with single metal layer | David N. Okada | 2009-10-20 |
| 5786230 | Method of fabricating multi-chip packages | Guillermo L. Romero | 1998-07-28 |
| 5751009 | Optical isolator having leadframe with non-planar mounting portions | Austin Harton, Jang-Hun Yeh, John Bliss, Karl W. Wyatt | 1998-05-12 |
| 5721612 | Optical pressure sensor and method therefor | — | 1998-02-24 |
| 5666269 | Metal matrix composite power dissipation apparatus | Guillermo L. Romero, Brent W. Pinder | 1997-09-09 |
| 5616886 | Wirebondless module package | Guillermo L. Romero | 1997-04-01 |
| 5535510 | Plastic encapsulated microelectronic device and method | John Baird, Martin A. Kalfus | 1996-07-16 |
| 5523629 | Plastic encapsulated microelectronic device | John Baird, Martin A. Kalfus | 1996-06-04 |
| 5508559 | Power circuit package | Guillermo L. Romero | 1996-04-16 |
| 5504351 | Insulated gate semiconductor device | — | 1996-04-02 |