Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7489519 | Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA | Sayaka Nishi, Takashi Hisada | 2009-02-10 |