WC

Wai Ling Chung-Maloney

IBM: 3 patents #26,272 of 70,183Top 40%
📍 Waterbury Center, VT: #6 of 17 inventorsTop 40%
🗺 Vermont: #1,707 of 4,968 inventorsTop 35%
Overall (All Time): #1,542,543 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
8448118 Determining intra-die wirebond pad placement locations in integrated circuit Richard S. Graf, Haruo Itoh 2013-05-21
7266789 Method and apparatus of optimizing the IO collar of a peripheral image Haruo Ito, Douglas W. Stout 2007-09-04
7194707 Method and apparatus for depopulating peripheral input/output cells Douglas W. Stout, Steven J. Urish 2007-03-20