Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8232651 | Bond pad for wafer and package for CMOS imager | James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe | 2012-07-31 |
| 8119456 | Bond pad for wafer and package for CMOS imager | James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe | 2012-02-21 |