Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5081563 | Multi-layer package incorporating a recessed cavity for a semiconductor chip | Bai-Cwo Feng, George C. Feng | 1992-01-14 |
RM
Richard H. McMaster
Overall (All Time): #3,841,938 of 4,157,543Top 95%
1
Patents All Time