Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5081563 | Multi-layer package incorporating a recessed cavity for a semiconductor chip | George C. Feng, Richard H. McMaster | 1992-01-14 |
| 4238559 | Two layer resist system | George C. Feng | 1980-12-09 |
| 4204009 | Two layer resist system | George C. Feng | 1980-05-20 |