Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5244833 | Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer | Volker Kreuter, Helmut Schettler | 1993-09-14 | $8,230,000 |
| 5010389 | Integrated circuit substrate with contacts thereon for a packaging structure | Volker Kreuter, Helmut Schettler | 1991-04-23 | $24,436,000 |