Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5244833 | Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer | Volker Kreuter, Helmut Schettler | 1993-09-14 |
| 5010389 | Integrated circuit substrate with contacts thereon for a packaging structure | Volker Kreuter, Helmut Schettler | 1991-04-23 |