LW

Leon L. Wu

IBM: 20 patents #5,451 of 70,183Top 8%
CU Columbia University: 2 patents #655 of 2,492Top 30%
NG Nanotek Instruments Group: 1 patents #35 of 54Top 65%
CY Consolidated Edison Company Of New York: 1 patents #66 of 180Top 40%
FT Fci Americas Technology: 1 patents #106 of 252Top 45%
PL Plantronics: 1 patents #228 of 433Top 55%
FA Flextronics Ap: 1 patents #179 of 385Top 50%
📍 New York, NY: #446 of 20,192 inventorsTop 3%
🗺 New York: #3,998 of 115,490 inventorsTop 4%
Overall (All Time): #124,442 of 4,157,543Top 3%
30
Patents All Time

Issued Patents All Time

Showing 26–30 of 30 patents

Patent #TitleCo-InventorsDate
4803595 Interposer chip technique for making engineering changes between interconnected semiconductor chips Charles J. Kraus 1989-02-07
4688151 Multilayered interposer board for powering high current chip modules Charles J. Kraus, Herbert I. Stoller 1987-08-18
4553050 Transmission line terminator-decoupling capacitor chip for off-chip driver Irving Feinberg, Leo Yuan 1985-11-12
4535388 High density wired module Charles J. Kraus, Herbert I. Stoller 1985-08-13
4274124 Thick film capacitor having very low internal inductance Irving Feinberg 1981-06-16