Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6599173 | Method to prevent leaving residual metal in CMP process of metal interconnect | Jose Luis Cruz, Cuc K. Huynh, Timothy C. Krywanczyk | 2003-07-29 |
| 5944583 | Composite polish pad for CMP | Jose Luis Cruz, Steven J. Messier, Matthew T. Tiersch | 1999-08-31 |
| 5885135 | CMP wafer carrier for preferential polishing of a wafer | Daniel D. Desorcie, Richard J. Lebel, Charles A. McKinney, Rock Nadeau, Timothy J. Rickard, Jr. +2 more | 1999-03-23 |
| 5842910 | Off-center grooved polish pad for CMP | Timothy C. Krywanczyk, Matthew T. Tiersch | 1998-12-01 |