| 5471948 |
Method of making a compound semiconductor having metallic inclusions |
Jeremy Burroughes, Rodney T. Hodgson, David T. McInturff, Michael R. Melloch, Nobuo Otsuka +2 more |
1995-12-05 |
| 5371399 |
Compound semiconductor having metallic inclusions and devices fabricated therefrom |
Jeremy Burroughes, Rodney T. Hodgson, David T. McInturff, Michael R. Melloch, Nobuo Otsuka +2 more |
1994-12-06 |
| 5221367 |
Strained defect-free epitaxial mismatched heterostructures and method of fabrication |
Matthew F. Chisholm, Peter D. Kirchner, Jerry M. Woodall |
1993-06-22 |
| 5021365 |
Compound semiconductor interface control using cationic ingredient oxide to prevent fermi level pinning |
Peter D. Kirchner, Jerry M. Woodall, Steven L. Wright |
1991-06-04 |
| 4920069 |
Submicron dimension compound semiconductor fabrication using thermal etching |
Eric R. Fossum, Peter D. Kirchner, George D. Pettit, Jerry M. Woodall |
1990-04-24 |
| 4843450 |
Compound semiconductor interface control |
Peter D. Kirchner, Jerry M. Woodall, Steven L. Wright |
1989-06-27 |
| 4811077 |
Compound semiconductor surface termination |
Alan B. Fowler, John L. Freeouf, Peter D. Kirchner, Jerry M. Woodall |
1989-03-07 |
