Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341116 | Chip package structure, preparation method, and electronic device | Chaojun Deng, Yong Yang | 2025-06-24 |
| 11862529 | Chip and manufacturing method thereof, and electronic device | Chaojun Deng, Yong Yang, Jiye Xu, Xing Fu | 2024-01-02 |
| 11776820 | Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method | Yong Yang, Chaojun Deng | 2023-10-03 |
| 11322701 | High dielectric constant composite material and application thereof | Hong Meng, Jupeng Cao, Lijia Yan, Yu He, Yanan Zhu +1 more | 2022-05-03 |