Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341116 | Chip package structure, preparation method, and electronic device | Xiaoyun WEI, Yong Yang | 2025-06-24 |
| 12058803 | Circuit board assembly and electronic device | Fei Ma, Wei Fang, Zhiwen Yang, Chungang Li, Shun Hao | 2024-08-06 |
| 11862529 | Chip and manufacturing method thereof, and electronic device | Xiaoyun WEI, Yong Yang, Jiye Xu, Xing Fu | 2024-01-02 |
| 11805592 | Circuit board assembly and electronic device | Fei Ma, Wei Fang, Zhiwen Yang, Chungang Li, Shun Hao | 2023-10-31 |
| 11776820 | Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method | Xiaoyun WEI, Yong Yang | 2023-10-03 |
| 11309967 | Communications network and related device | Liankui Lin | 2022-04-19 |
| 10945068 | Ultrasonic wave-based voice signal transmission system and method | Liming Fang | 2021-03-09 |
| 7936776 | Smooth capacity expansion method and system for data communication products | — | 2011-05-03 |
| 7826495 | Method, Ethernet device and Ethernet for clock synchronization | Jinhua Ye | 2010-11-02 |
| 7724646 | System and method for implementing service switching | Ziqiang Wang, Jinhua Ye | 2010-05-25 |
| 7602804 | Smooth capacity expansion method and system for data communication products | — | 2009-10-13 |