Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8575492 | Hole in pad thermal management | Leonard De Oto, Tim Larson, Patrick J. O'Keefe, Jr., Herb Gertz | 2013-11-05 |
| 8112884 | Method for providing an efficient thermal transfer through a printed circuit board | Leonard De Oto, Tim Larson, Patrick J. O'Keefe, Jr., Herb Gertz | 2012-02-14 |
| 7193863 | Electronics packaging assembly with parallel circuit boards and a vibration stiffener | William M. Tillinghast | 2007-03-20 |