Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8575492 | Hole in pad thermal management | Lee H. Tullidge, Leonard De Oto, Tim Larson, Patrick J. O'Keefe, Jr. | 2013-11-05 |
| 8112884 | Method for providing an efficient thermal transfer through a printed circuit board | Lee H. Tullidge, Leonard De Oto, Tim Larson, Patrick J. O'Keefe, Jr. | 2012-02-14 |