Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5705858 | Packaging structure for a hermetically sealed flip chip semiconductor device | — | 1998-01-06 |
| 5640052 | Interconnection structure of electronic parts | — | 1997-06-17 |
| 5386625 | Tab type IC assembling method and an IC assembled thereby | — | 1995-02-07 |
| 4828937 | Process for producing hollow extrudate for use in vacuum | Yutaka Kato, Eizo Isoyama | 1989-05-09 |
| 4806436 | Substrate for amorphous silicon solar cells | Kiyoshi Tada, Tatsuo Otsuka | 1989-02-21 |
| 4615747 | Process for producing aluminum material for use in vacuum | Yutaka Kato, Eizo Isoyama | 1986-10-07 |
| 4469512 | Process for producing high-purity aluminum | Hideo Shingu, Kozo Arai, Masashi Sakaguchi, Toshio Nishide, Osamu Watanabe +2 more | 1984-09-04 |