Wei-Jun Wang

Foxconn: 51 patents #67 of 5,504Top 2%

TE Tencent: 40 patents #70 of 8,131Top 1%

CE Compal Electronics: 20 patents #31 of 873Top 4%

HO Honeywell: 13 patents #693 of 14,447Top 5%

BL Backbone Labs: 8 patents #3 of 17Top 20%

IE Institute Of Materials Research And Engineering: 2 patents #6 of 38Top 20%

OG Osram Opto Semiconductors Gmbh: 2 patents #532 of 1,154Top 50%

University of California: 2 patents #4,561 of 18,278Top 25%

FC Fu Tai Hua Industry (Shenzhen) Co.: 2 patents #160 of 543Top 30%

RO Rogers: 1 patents #106 of 245Top 45%

HC Hong Fu Jin Precision Industry Co.: 1 patents #1 of 22Top 5%

IN Inventec: 1 patents #521 of 1,270Top 45%

IT Inventec (Pudong) Technology: 1 patents #246 of 568Top 45%

📍 Burlington, MA: #5 of 774 inventorsTop 1%

🗺 Massachusetts: #243 of 88,656 inventorsTop 1%

Overall (All Time): #14,073 of 4,157,543Top 1%

101

Patents All Time

Issued Patents All Time

Showing 101–101 of 101 patents

Patent #	Title	Co-Inventors	Date
6949825	Laminates for encapsulating devices	Ewald Guenther, Soo Jin Chua	2005-09-27