Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021059 | Wafer-bonding structure and method of forming thereof | Hsingya Arthur Wang, Sheng-Yuan CHOU, Yu-Ting Wang | 2024-06-25 |
| D805568 | Mobile platform for a robot arm | Cheng-Tang Ke, Kun-Jia Hsu, Dong-Gu Lai, Ren-Jeng Wang, Chi-Hong Lin | 2017-12-19 |
| D790618 | Robot arm | Cheng-Tang Ke, Kun-Jia Hsu, Dong-Gu Lai, Ren-Jeng Wang, Chi-Hong Lin | 2017-06-27 |
| D783695 | End effector for a robot arm | Cheng-Tang Ke, Kun-Jia Hsu, Dong-Gu Lai, Ren-Jeng Wang, Chi-Hong Lin | 2017-04-11 |