Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5299091 | Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same | Akio Hoshi, Yukihiro Sato, Isao Yoshida, Kouzou Sakamoto | 1994-03-29 |
| 4814288 | Method of fabricating semiconductor devices which include vertical elements and control elements | Masatoshi Kimura, Takeaki Okabe, Isao Yoshida, Kouzou Sakamoto, Kazuo Hoya +2 more | 1989-03-21 |
| 4443812 | High-breakdown-voltage semiconductor device | Ichiro Imaizumi, Masatoshi Kimura, Shikayuki Ochi, Masayoshi Yoshimura, Takashi Yamaguchi | 1984-04-17 |
| 4423433 | High-breakdown-voltage resistance element for integrated circuit with a plurality of multilayer, overlapping electrodes | Ichiro Imaizumi, Shikayuki Ochi, Masatoshi Kimura, Masayoshi Yoshimura, Takashi Yamaguchi | 1983-12-27 |