Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7518233 | Sealing structure for multi-chip module | Kouichi Takahashi, Kenichi Kasai, Takahiro Daikoku, Takayuki Uda, Toshitada Netsu +2 more | 2009-04-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7518233 | Sealing structure for multi-chip module | Kouichi Takahashi, Kenichi Kasai, Takahiro Daikoku, Takayuki Uda, Toshitada Netsu +2 more | 2009-04-14 |