Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7005673 | ITO film-formed substrate, and manufacturing method thereof | Yukihiro Katoh | 2006-02-28 |
| 6815761 | Semiconductor integrated circuit device | Toshiaki Nishimoto, Takashi Aoyagi | 2004-11-09 |
| 6806130 | Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device | Hiroto Kawagoe, Tatsumi Shirasu, Norio Suzuki, Eiichi Yamada, Yuji Sugino +4 more | 2004-10-19 |
| 6685805 | Method of manufacturing substrate having transparent conductive film, substrate having transparent conductive film manufactured using the method, and touch panel using the substrate | Yukihiro Katoh | 2004-02-03 |
| 6630375 | Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device | Hiroto Kawagoe, Tatsumi Shirasu, Norio Suzuki, Eiichi Yamada, Yuji Sugino +4 more | 2003-10-07 |
| 6583467 | Semiconductor integrated circuit device | Toshiaki Nishimoto, Takashi Aoyagi | 2003-06-24 |
| 6444514 | Semiconductor integrated circuit device and manufacturing method thereof | Toshiaki Nishimoto, Takashi Aoyagi | 2002-09-03 |
| 6368905 | Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device | Hiroto Kawagoe, Tatsumi Shirasu, Norio Suzuki, Eiichi Yamada, Yuji Sugino +4 more | 2002-04-09 |
| 6043114 | Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device | Hiroto Kawagoe, Tatsumi Shirasu, Norio Suzuki, Eiichi Yamada, Yuji Sugino +4 more | 2000-03-28 |