Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6503803 | Method of fabricating a semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer | Hideo Miura, Masayuki Suzuki, Shinji Nishihara, Shuji Ikeda, Masashi Sahara +5 more | 2003-01-07 |
| 6268658 | Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof | Hideo Miura, Masayuki Suzuki, Shinji Nishihara, Shuji Ikeda, Masashi Sahara +5 more | 2001-07-31 |
| 6031288 | Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof | Hideo Miura, Masayuki Suzuki, Shinji Nishihara, Shuji Ikeda, Masashi Sahara +5 more | 2000-02-29 |