HF

Hideko Fukushima

HI Hitachi: 15 patents #2,636 of 28,497Top 10%
5M 501 Hitachi Metals: 1 patents #1 of 21Top 5%
Overall (All Time): #296,939 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
10040116 Method of manufacturing ceramic sintered body and ceramic sintered body Masayoshi Date, Tsuyoshi Yamamoto, Shuhei Iwagaki 2018-08-07
9839957 Ceramic core, manufacturing method for the same, manufacturing method for casting using the ceramic core, and casting manufactured by the method 2017-12-12
9837543 Oxide semiconductor target, oxide semiconductor film and method for producing same, and thin film transistor Hiroyuki Uchiyama 2017-12-05
9539639 Ceramic core and method for producing same 2017-01-10
9276123 Oxide semiconductor target and oxide semiconductor material, as well as semiconductor device using the same Hironori Wakana, Hiroyuki Uchiyama 2016-03-01
7923103 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods 2011-04-12
7851055 High-thermal-conductivity graphite-particles-dispersed-composite and its production method 2010-12-14
7708050 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods 2010-05-04
7282265 Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods 2007-10-16
6705860 Setter for burning Hirohisa Suwabe 2004-03-16
6362120 Alumina ceramic composition 2002-03-26
6221271 Piezoelectric sintered ceramics and piezoelectric ceramic elements constituted thereby Junichi Watanabe, Hiromi Kikuchi, Shigeru Jomura 2001-04-24
6045893 Multilayered electronic part with minimum silver diffusion Naoyuki Satoh, Hiroyuki Itoh, Tomomi Ogawa 2000-04-04
5457075 Sintered ceramic composite and molten metal contact member produced therefrom Yasuo Sawano, Katsuhiko Kojo 1995-10-10
5096863 Diffusion-bonded assembly of AlN ceramic bodies and heat dissipation member constituted thereby 1992-03-17
5077244 Aluminum nitride sintered body and semiconductor substrate thereof Yusuke Iyori 1991-12-31